產品資訊 - silicon ingots adhesive mounting system->adhesive

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Shanghai Duwell Electronics Co Ltd

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silicon ingots adhesive mounting system

產品分類 :

化學->其他->膠黏劑

產品規格

Country	CN
Brand	Duwell
Materials	Epoxy adhesives
Weight	1kg per poly pail
Packing	poly pail/can
Minimum Order	10kg
Payment Term	30% prepayment by TT,70% on B/L notice

產品描述

water-debondable epoxy adhesive that bonds silicon and glass/metal mounting substrates during silicon ingot slicing operations,

Duwell-Silicon Ingot Epoxy adhesives for wafer slicing process.

1.D series- epoxy adhesives for silicon ingot ,glass and metal adhesion
2.W series-epoxy adhesives for glass and metal adhesion(water release/heat release)
3.Other-epoxy adhesives for two or more ingots connection to improve output.

Application:

a water-debondable epoxy adhesive that bonds silicon and glass/metal mounting substrates during silicon ingot slicing operations, protecting against wafer breakage.

Basic information

Two-component epoxy adhesive include resin A and hardener B

Resin and Hardener Mix ratio: 1:1

Package: resin-1kg/can ,hardener-1kg/can

Gel time/Cure time/Work time-There are several options for choices.

More product options and specifications,please contact our sales engineer for consultation

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