產品資訊 - polyimide tape->insulation tape

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Shenzhen CIT Electronics Material Co.,Ltd

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polyimide tape

產品分類 :

能源及原料->塑膠,橡膠,包裝材料->塑膠製品->電氣絕緣膠帶

產品規格

Country	CN
Brand	CIT
Materials	polyimide tape

產品描述

Fundamental Material: Polyamide Flim

Fundamental Material Thickness : 0.025mm

Total Thickness: 0.065mm+/-0.05mm

Tensile Strength: 135 N /25mm

Elongation : 0.35

Adhesion Strength: 5.50 N/25mm +/-0.5N/25mm

Breakdown Voltage : 5KV

Extended Heat-Resistance: 300C

2. Standard Package
33M long a roll

3. Production Characteristic
This product has many advanced properties, anti-static layer, heat resistance, fire-prevention, which is fit for the use of transformer and coil wounding and protection of PCB gold finger contacts , while it will protect electric products from possible damage due to the static electricity.
Description:
Polyimide consisting of a polyimide film and silicone adhesive designed for high temperature masking applications, including the protection of gold edge fingers and edge connectors during wave soldering and reflow soldering processes within the PCB assembly industry. It is used in electrical insulation application meeting class H requirements.
Main Features:
. Thin and conformable enabling masking of uneven sufaces.
. Wide operaturing tempreture range up to 500 F.
. Excellent electrical insulation
. Remove clearly without adhesive residue after exposure to heat/chemical
Applications:
. Masking for protection of gold fingers and edge connectors during wave soldering and reflow soldering processes or solder dip process within the PCB assembly industry.
. Release surface in fabrication of parts cured at elevated temperatures.
. Widely used for electrical insulation on transformer, motor, coil, PCB masking and so on.

.Linered Polyimide Tape
Description:
Linered polyimide tape consists of a PET Fluorosilicone Release liner with polyimide film and silicone adhesive designed for die-cut high temperature masking dots, used for protection of gold fingers and edge connectors during wave soldering and reflow soldering processes or solder dip processes of PCB assembly industry. It is used in electrical insulation application meeting class H requirement.

Main Feartures:
. Wide operating temperature range up to 500 F.
. Excellent electrical insulation.
. Remove clearly without adhesive residue after exposure to heat or chemicals.

Application:
Used for die-cut polyimide dots.

. High Tempetature Polyimide Disc

Description:
This part die cuts from linered polyimide tape, consisting a PET Fluorosilicone release liner with polyimide film and silicone adhesive designed for protection of gold fingers and edge connectors during wave soldering and reflow soldering processes within the PCB assembly industry.

Features:
. Wide operating temperature range up to 500 F.
. Remove clearly without adhesive residue after exposure to heat or chemical.

Application:
. Masking gold finger and edge connectors of PCB.
. Protecting surface during high temperature powder coating.
. Other high temperature protection applications.