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Sputtering Targets:coating materials for the applications to magnetic disk and head, magneto optical disk, optical disk, superconducting thin film, protective film.
Purity: 99%, 99.9%,99.95% 99.99%,99.995% 99.999% and 99.9999%.
Shape: foil, sheet, wire, filament, rod, pipe, tube, powder, pellet, shot, wafer, plate, tablet, ingot, chunk, lump, granule, dendritic, crystal, etc.
Dimension: Diameter (<500mm), Length (<1000mm), Width (<500mm), Thickness (>1mm), Custom-Made
Metal Sputtering Targets or rare earth metal sputtering targets: Lanthanum (La),Cerium (Ce),Praseodymium (Pr), Neodymium (Nd),Samarium (Sm),Europium (Eu),Gadolinium (Gd),Terbium (Tb),Dysprosium (Dy),Holmium (Ho), Erbium (Er) ; Thulium (Tm), Ytterbium (Yb), Lutetium (Lu), Scandium (Sc), Yttrium (Y) Aluminum (Al),Antimony (Sb),Bismuth (Bi),Boron (B),Cadmium (Cd),Carbon (C),Chromium (Cr),Cobalt (Co),Copper (Cu),Germanium (Ge),Gold (Au) ,Graphite (C),Hafnium (Hf) , Indium (In),Iridium (Ir),Iron (Fe),Magnesium (Mg),Manganese (Mn),Molybdenum (Mo),Nickel (Ni),Niobium (Nb) ,Palladium (Pd),Platinum (Pt),Rhenium (Re) ,Ruthenium (Ru),Selenium (Se),Silver (Ag),Silicon (Si),Tantalum (Ta),Tin (Sn),Titanium (Ti),Tungsten (W),Vanadium (V),Zirconium (Zr),Zinc (Zn)
Alloy Sputtering Targets: Aluminum Copper (Al-Cu),Aluminum Silicon (Al-Si),Cerium Gadolinium (Ce-Gd), Aluminum Magnesium(Al-Mg),Aluminum Silver (Al-Ag),Chromium Aluminum (Cr-Al),Cerium Samarium (Ce-Sm),Chromium Silicon (Cr-Si),Cobalt Chromium (Co-Cr),Cobalt Iron (Co-Fe),Cobalt Iron Boron (Co-Fe-B),Copper Gallium (Cu-Ga), Copper Nickel (Cu-Ni),Copper Zirconium (Cu-Zr),In dium Tin (In-Sn),Iridium Manganese (Ir-Mn),Iron Boron (Fe-B), Iridium Rhenium (Ir-Re),Iron Carbon (Fe-C),Molybdenum Silicon (Mo-Si),Nickel-Aluminum (Ni-Al),Nickel-Chromium (Ni-Cr), Nickel-Chromium Silicon (Ni-Cr-Si),Nickel-Iron (Ni-Fe),Nickel-Titanium (Ni-Ti),Nickel-Vanadium (Ni-V),Silver Copper (Ag-Cu),Silver Tin (Ag-Sn), Samarium Cobalt (Sm-Co),Tantalum Aluminum (Ta-Al),Titanium Aluminum (Ti-Al),Titanium Nickel (Ti-Ni),Terbium Dysprosium Iron Alloy (TbDyFe),Terbium Iron Alloy (TbFe),Zirconium Aluminum (Zr-Al),Zirconium Iron (Zr-Fe),Zirconium Nickel (Zr-Ni),Zirconium Niobium (Zr-Nb) ,Zirconium Titanium (Zr-Ti), Zirconium Yttrium (Zr-Y)
Ceramic Sputtering Targets:Aluminum Oxide (Al2O3),Antimony Oxide (Sb2O3),Barium Fluoride (BaF2),Bismuth Oxide (Bi2O3),Boron Nitride (BN),Calcium Fluoride (CaF2),Cadmium Sulfide (CdS),Cerium oxide (CeO2),Cerium fluoride (CeF3),Chromium Oxide (Cr2O3),Gallium Arsenide (Crystal) (GaAs),Gadolinium Oxide (Gd2O3),Hafnium Oxide (HfO2),Indium Oxide. Tin Oxide Target (ITO),Lead Zirconate (PbZrO3), Lanthanum fluoride(LaF3), Magnesium fluoride (MgF2), Magnesium Oxide(MgO),Molybdenum (MoO), Neodymium Oxide (Nd2O3), Neodymium fluoride(NdF3), Nickel Oxide(NiO), Niobium Pentoxide(Nb2O5), Praseodymium Oxide (Pr6O11), Samarium, Oxide(Sm2O3), Silicon Monoxide(SiO), Silicon Oxide(SiO2), Silicom Carbide (SiC), Silicom Nitride (Si3N4), Strontium Fluoride (SrF3), Tantalum Pentoxide(Ta2O5), Titanium Monoxide (TiO), Titanium Dioxide (TiO2) ,Titanium Rioxide (Ti2O3), Titanium Pentoxide (Ti3O5), Vanadium Pentoxide (V2O5), Tungsten Oxide (WO3), Yttrium oxide (Y2O3), Ytterbium Fluoride (YbF3), Zinc oxide (ZnO), Zinc Selenium (ZnSe), Zinc:aluminium oxide (ZnO:Al) ,Zinc Sulfide (ZnS), Zirconium oxide (ZrO2)
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