登入 加入會員 求助
 
準力機械股份有限公司
 
 
Recommended Results 
 
The design of the wafer grinding machine is basically inheriting the work principle of a vertical gr 

  產品分類 : 機械與設備->工具機->磨床->工具磨床

     
The design of the wafer grinding machine is basically inheriting the work principle of a vertical gr
       

  產品規格
 
Model No:    JL-200SCG
  Country  0

 

  產品描述
   
  The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafer surface grinding can be achieved only by a specially design ed wafer grinding machines.
The machine employs an air floating spindle fitted with a diamond grinding wheel - the water is sucked onto an air floating table.

  其他類似產品
 
Semi Automatic Precision Surface Grinders

Semi Automatic Precision Surface Grinders
Hydraulic Grinding Machines

Hydraulic Grinding Machines
High Precision CNC Profile Surface Grinding Machines

High Precision CNC Profile Surface Grinding Machines
Hand Operated Surface Grinders

Hand Operated Surface Grinders
 
   


[ Back Products Catalog ]

Commerce 會員:
請登入您的 帳號 跟 密碼, 系統將自動為您填入您的相關基本資料!
 
帳號:
密碼:
記住我的帳號
 
 
填寫下列表格並寄送詢問函.所有的詢問信函將會自動寄發給你想聯絡的公司
主旨
內容 ﹙ 請勿輸入公司名稱、Email、電話、傳真、網址 ﹚
   

 


公司簡介:

*公司名稱
*E-mail
*國家
*聯絡人
網址
*電話
- -
傳真
- -
*郵遞區號
*城市
*街道地址
*企業形態
批發商   出口商 進口商 製造商
大盤商 零售商  代理商 Retrofitter 使用者
其他, 請詳細說明:
*安全密碼
請輸入所顯示的安全密碼


網站導覽 l 隱私權政策 l 服務團隊 l 合作提案 l 聯絡我們 l 幫幫我 l 廣告刊登 l  B2B商業夥伴
    .