Shin Puu Technology Co., Ltd. – 線上商品櫥窗

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1. Optical Fiber Communication System PCB

Technologies

A Any layer HDI
B Aspect ratio up to 25
C Back drill
D Board thickness 10 mm
E Cavity down
F High speed and low loss materials
G Layer count up to 40
H Micro via copper fill plate
I Minimum line width and spacing ...

2. Microwave and Telecommunication Equipment PCB

Technologies

A Any layer HDI
B Aspect ratio up to 25
C Back drill
D Board thickness 10 mm
E Cavity down
F Diversity specialty processes PCB and PCBA
G Heavy copper products up to 6 oz
H High speed low loss and multiple material combination ...

3. Defense Electronics PCB

Technologies

A Any layer HDI
B AS 9100D certified products
C Cavity down
D Diversity specialty processes PCB and PCBA
E Heavy-copper products up to 6 oz
F IPC A 600 class 3 certified products
G Metal core PCB aluminum & copper
H ...

4. Automotive Electronics PCB

Technologies

A Heavy copper products up to 6 oz
B HDI capability and capacity for advanced automotive applications
C IATF 16949 certified products
D IPC A 600 class 3 certified products
E Metal core PCB aluminum & copper
F RF and high ...

5. Aerospace Electronics PCB

Technologies
A Any layer HDI
B AS-9100D certified products
C Cavity down
D Diversity specialty processes PCB & PCBA
E Heavy-copper products up to 6 oz
F IPC-A-600 class 3 certified products
G IPC-6012D/DS certified products
H Metal ...